Why Has Thermal Silica Become The Preferred Material for Heat Dissipation in Electronic Equipment? ​

1. Excellent thermal conductivity

Thermal conductive silicone has excellent thermal conductivity and can quickly conduct heat generated by electronic devices. Its high thermal conductivity helps to effectively transfer heat from the heat source to the heat dissipation components and improves the heat dissipation effect.

2. Good adhesion

Good adhesion can firmly adhere between electronic components and heat sinks, filling tiny gaps. This helps reduce interface thermal resistance and improve thermal energy conduction efficiency.

3. Softness and deformability

Thermal conductive silicone usually has a certain degree of softness and deformability, and can adapt to the surfaces of electronic components of different shapes and sizes. This enables it to better fit the surface, increase the contact area, and enhance the heat conduction effect in complex electronic device structures.

4. Insulation performance

Most thermally conductive silica gel has good insulation properties and can effectively isolate heat, prevent heat conduction between electronic components, reduce the impact of thermal cross-over, and improve the stability and reliability of electronic equipment.

5. High temperature resistance

Thermal conductive silicone is generally able to withstand higher temperatures, which is particularly important in the high-temperature environments generated when electronic equipment is working. Its high temperature resistance helps maintain the stability of the heat dissipation system and avoid the performance degradation of the silicone material itself.

6. Easy to process and apply

Thermal conductive silicone has good processability and can be cut, pasted and applied according to the specific needs of electronic devices. This ease of processing allows manufacturers to flexibly apply thermal silicone to meet the heat dissipation requirements of different devices.