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CPU thermal conductive glue is a high-performance thermal conductive material designed to improve the heat dissipation effect of electronic devices. It quickly conducts heat by forming a close contact between the CPU and the heat sink, ensuring efficient operation of the device and extending its service life.
Excellent thermal conductivity
The thermal conductivity coefficient is as high as 5.0 W/m·K or above, which effectively reduces the CPU core temperature and is suitable for high-performance computers, servers and gaming devices.
Strong adhesion
Thermal conductive glue not only conducts heat, but also has excellent adhesion properties to ensure a stable connection of the heat sink to prevent loosening or displacement during long-term use.
Easy to apply
With good fluidity and uniform coating characteristics, users can easily apply it on the CPU surface to reduce bubble generation and ensure thermal conductivity.
Strong high temperature resistance
Can withstand operating temperatures from -50°C to 200°C, ensuring stable performance even in extreme environments.
Environmentally friendly and non-toxic
Complies with RoHS and REACH environmental standards, no volatile organic compounds (VOC), safe and reliable to use.
Computers and electronic devices
Applicable to CPU and GPU cooling of desktops, laptops, tablets and other electronic devices.
Servers and data centers
In high-density servers and storage devices, thermal conductive glue can significantly improve heat dissipation efficiency and reduce hardware loss.
Industrial electronic products
Including power modules, LED lighting and communication equipment and other fields that require efficient thermal management.
Product advantages
·Provide OEM and ODM services, and adjust parameters such as thermal conductivity and viscosity according to customer needs.
·After multiple rounds of rigorous testing, ensure long-term stability of product performance and support batch supply.
·Flexible packaging: supports syringe packaging, small tube packaging, large barrel packaging and other specifications to meet personal and corporate needs.
Choose Jiahewell's CPU thermal conductive glue to ensure efficient heat dissipation of your equipment and easily cope with high-load tasks! If you need to order or learn more details, please feel free to contact us.
contact information
Company name: JiaheWell
Mail: jiahewell@jhzhb.com
Telephone: +86-13928321129
WhatsApp： +86-13433514547
Our Team
CPU thermal conductive glue is a high-performance thermal conductive material designed to improve the heat dissipation effect of electronic devices. It quickly conducts heat by forming a close contact between the CPU and the heat sink, ensuring efficient operation of the device and extending its service life.
Excellent thermal conductivity
The thermal conductivity coefficient is as high as 5.0 W/m·K or above, which effectively reduces the CPU core temperature and is suitable for high-performance computers, servers and gaming devices.
Strong adhesion
Thermal conductive glue not only conducts heat, but also has excellent adhesion properties to ensure a stable connection of the heat sink to prevent loosening or displacement during long-term use.
Easy to apply
With good fluidity and uniform coating characteristics, users can easily apply it on the CPU surface to reduce bubble generation and ensure thermal conductivity.
Strong high temperature resistance
Can withstand operating temperatures from -50°C to 200°C, ensuring stable performance even in extreme environments.
Environmentally friendly and non-toxic
Complies with RoHS and REACH environmental standards, no volatile organic compounds (VOC), safe and reliable to use.
Computers and electronic devices
Applicable to CPU and GPU cooling of desktops, laptops, tablets and other electronic devices.
Servers and data centers
In high-density servers and storage devices, thermal conductive glue can significantly improve heat dissipation efficiency and reduce hardware loss.
Industrial electronic products
Including power modules, LED lighting and communication equipment and other fields that require efficient thermal management.
Product advantages
·Provide OEM and ODM services, and adjust parameters such as thermal conductivity and viscosity according to customer needs.
·After multiple rounds of rigorous testing, ensure long-term stability of product performance and support batch supply.
·Flexible packaging: supports syringe packaging, small tube packaging, large barrel packaging and other specifications to meet personal and corporate needs.
Choose Jiahewell's CPU thermal conductive glue to ensure efficient heat dissipation of your equipment and easily cope with high-load tasks! If you need to order or learn more details, please feel free to contact us.
contact information
Company name: JiaheWell
Mail: jiahewell@jhzhb.com
Telephone: +86-13928321129
WhatsApp： +86-13433514547
Our Team
